DOSHIBEKOVA, A.; JURINSKAYA, I.; TASHPULATOV , S. Investigation of the influence of technological parameters on the copper deposition process. Eurasian Journal of Applied Engineering and Technology (EJAET), [S. l.], v. 145, n. 4, p. 302–311, 2023. DOI: 10.32523/2616-7263-2023-145-4-302-311. Disponível em: https://bultech.enu.kz/index.php/main/article/view/580. Acesso em: 8 jul. 2026.