Doshibekova, A., I. Jurinskaya, and S. Tashpulatov. “Investigation of the Influence of Technological Parameters on the Copper Deposition Process”. Eurasian Journal of Applied Engineering and Technology (EJAET), vol. 145, no. 4, Dec. 2023, pp. 302-11, doi:10.32523/2616-7263-2023-145-4-302-311.