Thermal conductive inclusions in building envelopes
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DOI:
https://doi.org/10.32523/2616-7263-2024-147-2-9-24Keywords:
enclosing structures, thermal conductive inclusionsAbstract
In order to reduce the heat loss of a building and meet the requirements of regulations, multi-storey building envelopes have been widely used in construction in recent years, including the placement of a thermal insulation layer inside the structure. Under the influence of economic considerations, one of the main types of building floors was a masonry cellular concrete block faced with brick with effective insulation between floors. Considering the modernization of existing types of building envelopes and the appearance of a large number of new structures, the question arose about the correct determination of the thermal properties (mainly thermal protection) of such structures.
Temperatures are evenly distributed because the heat dissipated over the surface of the structure helps to balance their values when looking at the room. However, the length of the temperature field distortion region increases (due to the presence of interference). On the contrary, the temperature decrease (which extends over a short length of the enclosure) becomes more prominent and noticeable due to inclusions and inclusions located on the warm surface of the structure.
Such peculiarities of temperature distribution in the zone of heat conducting inclusions of different types are confirmed by the experience of operation of buildings with corresponding design solutions for panel walls. If the walls at the joints of panels are covered with a thermally conductive protective and finishing layer on the warm side, the temperature distribution over the inner surface of the wall will be uniform; if there is not enough thermal conductive inclusions and inclusions located on the warm surface of the wall, the temperature distribution will be uniform.