Investigation of the influence of technological parameters on the copper deposition process
Views: 103 / PDF downloads: 65
DOI:
https://doi.org/10.32523/2616-7263-2023-145-4-302-311Keywords:
electrically conductive chemical fibers, electrical conductivity, electrical resistance, electrolyte, electrodepositionAbstract
The possibility of electroplating copper coatings on chemically and chemical-galvanically nickel-plated acrylic fibers has been studied. The effect of electrolyte pH, its composition, current strength at the 1st and 2nd cathodes, as well as the metallization time on the electrophysical, physical and mechanical properties of copper-containing fibers have been studied.
Electrically conductive fibers with different copper contents have been obtained. Regularities have been established for the change in the electrical properties of fibers depending on the content of copper. The studies have shown that with an increase in the copper content, the electrical conductivity, the uniformity of the coating and the uniformity of the electrophysical properties (for chemical-galvanically nickel-plated fiber) increase. In the case of copper plating of chemically nickel-plated fiber, the coefficient of variation in electrical resistance increases with increasing plating time, despite the fact that the copper content increases, and the coefficient of variation in copper content and electrical resistance decreases.